Requirements:

1.    Bachelor degree or above in engineering, plus 3 years relative working experience;

2.    Strong semiconductor device physics and processing background;

3.    Familiar with foundries and package houses in Taiwan and mainland;

4.    Familiar with mobile TV is a plus

5.    Good understanding on foundry processes, package forms(TFBGA, SIP) & testing procedures;

6.    Knowledge of semiconductor defect/failure analysis, ESD, reliability testing, data analysis and statistics knowledge, wafer processing knowledge;

7.    Be able to work under stress in a fast-paced environment and travel frequently;

8.    Excellent command of both spoken and written English and Mandarin;

9.    The position is based on Beijing;

Responsibilities:

1.    Lead the efforts to understand root causes and execute on corrective actions for products not meeting expectations in performance, quality or reliability ;

2.    Perform data and failure analysis for new process yield learning, production cost reduction and discrepant material disposition;

3.    Define and coordinate ESD/reliability tests;

4.    Engage and establish close business relationship with foundry, package and testing vendors ;

5.    Negotiate with suppliers on pricing, delivery date and technical support;